Software Engineer (C#) - Packaging [Taiwan]


 

Software Engineer (C#) - Packaging

Tasks

- New software feature design and implement for automation machine applications to enhance our product’s
capability

- Work with product specialists, hardware and process engineers to develop new features

- Software requirement analysis and documentation

- Customer side Software issue support

- Customer specific software requirement analysis

- Debugging on machine

- Using version control and issue tracking tool for software release management and documentation

Education

- Bachelor/Master/PH.D degree of Automation, Mechatronics or Computer Science

Work Experience

- Minimum 3 years broad experience in SW design and implementation using C++ under a Linux environment

- Experience in multi-tasking application development

- Knowledge of software process, quality, version control and testing methodologies

- Knowledge of the semiconductor backend industry

- An understanding of mechanical systems, electronics or semiconductor packaging process will be an
advantage

Expertise and Methodology
(Business knowledge, languages, MS-Office, etc.)

- C++ programming in a Linux environment

- Object-oriented programing knowledge

- Experience with QT framework

- Practical work in the laboratory on machine and measuring technology

- Conceptual and analytical thinking and systematic approach

- Experience with Agile software development process will be an advantage

Other Requirement Criteria
(Personal related competence as social competence, management competence, strategic competence, etc.)

- Teamwork, flexibility

- Self-initiative and ability to work independently

- Discipline, perseverance, resilience

- Good Knowledge of English

- Good communication skills in a global environment

- Due to the occasional need for written communication with German customers, an ability to read and write
German is a plus."

Interested?
Please contact Shirley Siew, +65 6303-7007 or shirley.siew@besi.com

Announcement from 11.05.2021 - 25.05.2021


 

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